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Jian Ku Shang

Jian Ku Shang
Associate Professor of Materials Science and Engineering

Office 106 Materials Science and Engineering Building

Telephone 217-333-9268 Fax 217-333-2736

Mail Address Department of Materials Science and Engineering
1304 W. Green St., Urbana, IL 61801

jkshang@illinois.edu

  • Profile
  • Research
  • Publications
  • Awards

Profile

Professor Shang received his B.E. from Xian Jiaotong University, China, 1982, his M.S. and Ph.D. in Materials Science from the University of California at Berkeley in 1987 and 1989. Following a brief postdoctoral experience at Berkeley, he joined the University of Illinois as an assistant professor in 1990 and became an associate professor in 1996. Professor Shang received UIUC College of Engineering Advisors Awards in 1996 and 1998; Burnett Teaching Fellowship in 1996; Burnett Excellence of Undergraduate Teaching Award in1995; Alcoa Foundation Fellowship in 1991; NSF Research Initiation Award in 1991. He is a guest professor at the Institute of Metal Research of the Chinese Academy of Sciences.

ResearchAntimicrobial materials, solder interconnect materials, ferroelectric and piezoelectric materials, composite materials and interfaces, deformation and fatigue.

Publications

Antimicrobial Materials

Wu, P., Xie, R. C., Imlay, J., and Shang, J. K., “Visible-light photocatalytic fibers for inactivation of Pseudomonas aeruginosa,” Ceramic Engng. Sci. Proc. (2006) in press.

Dong, C. X., Xian, A. P., Han, E. H., Shang, J. K., “C-doped TiO2 with Visible-light Photocatalytic Activity,” J. Solid State Phen. (2005) in press.

Dong, C. X., Xian, A. P., Han, E. H., Shang, J. K., “Acid-mediated Sol-gel Synthesis of Visible-light Active Photocatalysts,” J. Mater. Sci. (2005) in press.

Wu, P., Ma, C., and Shang, J. K., “ Effects of nitrogen doping on optical properties of TiO2 thin films,” Applied Pysics A-Mater. Sci. Process. 81, no. 7 (2005): 1411-17.

Solder Interconnect Materials

Yang, Q. L., and Shang, J. K., “Interfacial segregation of Bi during current stressing of Sn-Bi/Cu interconnect,” J. Electronic Materials 34 (2005): 1363-67.

Liu, P., and Shang, J. K., “Segregant-induced cavitation of Sn/Cu reactive interface,” Scripta Mater. 53, no. 6 (2005): 631-34.

Liu, P., and Shang, J. K., “Fracture of SnBi/Ni(P) Interfaces,” J. Mater. Res 20, no. 4 (2005): 818-26.

Zeng, Q., Wang, Z. G., Xian, A. P., and Shang, J. K., “Cyclic softening of Sn-3.8Ag- 0.7Cu Pb-free solder alloy with equiaxed grain structure,” J. Electronic Materials 34, no. 1 (2005): 62-67.

Liu, P. L., and Shang, J. K., “Interfacial Embrittlement Induced by Bismuth Segregation in Copper/Tin-bismuth Solder Interconnect,” J. Mat. Res. 16 (2001): 1651-59.

Liu, P. L., and Shang, J. K., “Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect,” Scripta Mater. 44 (2001): 1019.

Shang, J. K., Huang, R. F., and Wilcox, Sr., D. L., “A Microindentation Technique for Determining Strength of Solder Interface with Silver Metallization on Low Temperature Co-fired Multilayer Ceramic Substrate,” J Electronic Mater. 30 (2001): 260-65.

Liu, P., and Shang, J. K., “A Comparative Fatigue Study of Solder/Electroless-nickel and Solder/Copper Interfaces,” J Mater Res. 15 (2000) 2347-55.

Liu, P., Xu, Z., and Shang, J. K., “Thermal Stability of Interface between Electroless Ni and Sn-Pb Eutectic Solder: Part A. Interfacial Chemistry and Microstructure,” Metall. Mater. Trans. A 31A (2000): 2857-66.

Liu, P., and Shang, J. K., “Thermal Stability of Interface between Electroless Ni and Sn-Pb Eutectic Solder: Part B. Interfacial Fatigue Resistance,” Metall. Mater. Trans. A 31A (2000): 2867-75.

Yao, D., and Shang, J. K., "Effect of Cooling Rate on Interfacial Fatigue Crack Growth in Sn-Pb/Cu Joints," IEEE Transactions: CPMT 19, no.1 (1996): 154-65.

Ferroelectric and Piezoelectric Materials

Tan, X., He, H., and Shang, J. K., “In situ TEM studies of electric field-induced phenomena in ferroelectrics,” J. Mater. Res 20, no. 7 (2005): 1641-53.

Tan, X., and Shang, J. K., “Intersection of a-domains in the c-domain matrix driven by electric field in tetragonal ferroelectric crystal,” J. App. Phys. 96 (2004) 2805.

Liu, M., Hsia, K. J., and Shang, J. K., “Driving Forces for Interfacial Fatigue Crack Growth by Piezoelectric Actuator,” J. Integ. Mater. Systems and Struct. 16 (2005): 557-66.

Tan, X., and Shang, J. K., “Field-induced domain interpenetration in tetragonal ferroelectric crystal,” J. App. Phys. 95 (2004): 635-39.

Tan, X., and Shang, J. K., “Partial dislocations at domain intersections in a tetragonal ferroelectric crystal,” J. Phys.: condense matter 16 (2004): 1455-66.

Tan, X., Du, T., and Shang, J.K., "Piezoelectric in-situ transmission electron microscopy technique for direct observations of fatigue damage accumulation in constrained metallic thin films,” Appl. Phys. Lett. 80 (2002): 3946-48.

Tan, X., and Shang, J. K., “In-situ TEM study of field-induced grain boundary cracking in lead zirconate titanate,” Phil. Mag. A 82 (2002): 1463-78.

Shang, J. K., and Tan, X., “Indentation-induced domain switching in PMN-PT piezoelectric crystal,” Acta Materialia 49 (2001): 2993-99.

Du, T., Liu, M., Seghi, S., Hsia, K. J., Economy, J., and Shang, J. K., “Piezoelectric actuation of crack growth along polymer-metal interface in adhesive bond,” J. Mat. Res. 16 (2001): 2885-92.

Tan, X., Xu, Z., Shang, J.K., and Han, P., “Direct observations of electric-field-induced domain-boundary cracking in piezoelectric Pb(Mg 1/3Nb 2/3)O 3-PbTiO 3 crystal,” Appl. Phy. Lett. 77 (2000): 1529.

Shang, J. K., and Tan, X., “A Maximum Strain Criterion for Cyclic Field-Induced Crack Growth in Ferroelectric Ceramics," Mater Sci Eng. A 301 (2001): 131-39.

Tan, X., Xu, Z., and Shang, J. K., “In-situ Transmission Electron Microscopy Observations of Electric-Field-Induced Domain Switching and Microcracking in Ferroelectric Ceramics,” Mater. Sci. Eng. A 314A (2001): 157.

Tan, X., and Shang, J. K., “Crack Deflection in Relaxor Ferroelectric PLZT under Inclined Cyclic Electric Field,” Scripta Mater. 43 (2000): 925.

Xu, Z., Tan, X., Han, P., and Shang, J. K., “In situ TEM study of electric-field-induced microcracking in single crystal 0.66Pb(Mg 1/3Nb 2/3)O 3-0.34PbTiO 3,” Appl. Phy. Lett. 76, no. 25 (2000): 3732-34.

Composite Materials

Deppisch, C., Liu, G., Xu, Y., Zangvil, A., Shang, J. K., Economy, J., "The Crystallization and Growth of AlB 2 Single Crystal Flakes in Alumiunm," J. Mater. Res. 13 (1998): 3485-98.

Deppisch, C., Liu, G., Shang, J. K., Economy, J., "Processing and Mechanical Properties of AlB 2 Flake Reinforced Al-Alloy Composites," Mater. Sci. Eng. A 225 (1997): 153.

Zhang, Z., and Shang, J. K., "Subcritical Crack Growth at Bi-Material Interface-Part III: Shear-Enhanced Crack Propagation Resistance at Polymer/Metal Interface," Metallurgical and Materials Transactions 27A (1996): 221-28.

Liu, G., and Shang, J. K., "Subcritical Crack Growth at Bi-Material Interface-Part II: Microstructural Effects on Fracture Resistance of Metal/Ceramic Interfaces," Metallurgical and Materials Transactions 27A (1996): 213-19.

Zhang, Z., and Shang, J. K., "Subcritical Crack Growth at Bi-Material Interface-Part I: Flexural Peel Technique," Metallurgical and Materials Transactions 27A (1996): 205-11.

Liu, G., and Shang, J. K., "Fatigue Crack Tip Opening Behavior in Particulate Reinforced Al-Alloy Composites," Acta Materialia 44 (1996): 79-91.

Zhang, Z., Shang, J. K., and Lawrence, F. V., "A Backface Strain Technique for Detecting Fatigue Crack Initiation in Adhesive Joints," J. Adhesion 49 (1995): 23-36.

Liu, G., Yao, D., and Shang, J. K., “Micromechanism of Accelerated Near-Threshold Fatigue Crack Growth in Al2O3/Al-Cu Composite at Elevated Temperature,” Metall. Mater. Trans. A 25A (1995): 1435.

Liu, G., Zhu, D., and Shang, J. K., "Enhanced Fatigue Crack Growth Resistance at Elevated Temperature in TiC/Ti-6Al-4V Composite: Microcrack Induced Crack Closure," Metall. Mater. Trans. A 25A (1995): 159.

Yao, D., and Shang, J. K., "Frequency Dependence of Fatigue Crack Growth in a SiC-TiB 2 Composite at Elevated Temperature," Acta Metallurgica et Materialia 42, no. 2 (1994): 589-96.

Liu, G., Zhang, Z., and Shang, J. K., "Interfacial Microstructure and Fracture of Al 2O 3 Particulate Reinforced Al-Cu Composite," Acta Metallurgica et Materialia 42, no. 1 (1994): 271-82.

Yao, D., and Shang, J. K., “An Anormalous Temperature Dependence of Cyclic Crack Growth in SiC Matrix Composite,” J. Am. Ceram. Soc. 77 (1994): 2911-16.

Awards
  • Parker Best Paper Award, ASM International, Golden Gate Chapter (1986-1987)
  • ARCO Fellowship in Materials Science, UC - Berkeley (1987-1988)
  • Junior Research Fellowship, Wolfson College, Oxford University (1989)
  • NSF Research Initiation Award (1991)
  • Alcoa Foundation Fellowship (1991-1992)
  • Incomplete list of teachers ranked as excellent, UIUC (1994)
  • Donald Burnett Teacher of the Year Award (1995)
  • Outstanding Undergraduate Advisor, UIUC (1995-1998)